USPTO Application No. 20080231304
Issued September 2008
Apparatus and Method for Controlling Temperature in a Chuck System
Issued: September 2008
Employer at Filing: inTEST Thermal Solutions, Mansfield, MA
Inventor: Abdellah Mourchid
Thermal Control
This invention covers an apparatus and method for precisely controlling the temperature of a chuck system
used in semiconductor test environments. Chuck systems are used in testing of semiconductor wafers and devices,
where precise and rapid temperature control is critical to test accuracy and throughput.
The patented system provides a real-time embedded control approach enabling highly accurate, stable, and responsive
thermal regulation across the chuck surface — improving test repeatability, reducing thermal settling time,
and extending the operational range of the system compared to prior art.
This technology was developed during Abdellah's tenure at inTEST Thermal Solutions and was integrated
into production products including the Thermo-Stream and Chuck temperature control systems.
Key Technical Areas Covered
- Real-time embedded algorithm for closed-loop temperature regulation in chuck systems
- Method for controlling heating and cooling elements to achieve precise thermal set points
- Apparatus comprising control hardware and firmware interfacing with thermal actuators and sensors
- Techniques for reducing thermal overshoot and settling time in semiconductor test equipment
- System architecture enabling integration with test station controllers via standard communication protocols
The Problem
Semiconductor device testing requires precise thermal control of the chuck surface that holds the device under test (DUT).
Existing systems struggled with thermal overshoot, slow settling times, and limited temperature range —
leading to test inaccuracies and throughput bottlenecks.
The Innovation
The patented approach introduced a novel real-time embedded control algorithm and hardware architecture
for managing thermal actuators with significantly improved precision and responsiveness — reducing
settling time and extending the usable temperature range of the chuck system.
The Application
The technology was commercially integrated into inTEST Thermal Solutions' Thermo-Stream product line
and Chuck temperature control systems — used by semiconductor manufacturers and test labs for
characterization and qualification of electronic components.
The Skills Applied
The invention leveraged embedded C firmware, real-time control systems theory, analog/digital hardware
design, PIC microcontrollers, and hardware/software co-design — all skills developed during
Abdellah's foundational years as an electrical engineer.